Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...

Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...

A technical paper titled “Detection of defective chips from nanostructures with a high-aspect ratio using hyperspectral ...

Third-party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.

The dream may be to have generative AI write RTL, but text is only one of the necessary things AI must understand to help ...

LLMs and machine learning are automating expertise in an aging workforce.

Despite its cost and complexity, HBM offers significant advantages when performance and bandwidth are critical.

A new technical paper titled “High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: ...

The Synopsys Custom Design flow provides unique benefits for power electronics designers, and the close collaboration with ...

Any optimization problem must have a clear, unambiguous specification and a way to define the goodness of the solution. Today ...

While the long-term future of mobile connectivity is bright, there are still short-term challenges to face.

A new technical paper titled “The backpropagation algorithm implemented on spiking neuromorphic hardware” was published by ...